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Advanced Product Information
December 14, 2001
TGA4501-EPU
28-31 GHz Ka Band HPA
Key Features * 0.25 um pHEMT Technology * 18 dB Nominal Gain * 34.5 dBm Nominal P1dB * 40 dBm OTOI Typical * Bias 6 V @ 2.1 A Primary Applications * Satellite Ground Terminal * Point-to-Point Radio
Chip Dimensions 4.290 mm x 3.019 mm Bias Conditions: Vd = 6 V, Id = 2..1 A
19 18 17 16 15 14 13 12 11 10 28
35 34.5
Gain (dB)
28.5
29
29.5
30
30.5
31
Frequency (GHz)
Pout @ P1dB (dBm)
34 33.5 33 32.5 32 31.5 31 28 28.5 29 29.5 30 30.5 31 Frequency (GHz)
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change without notice.
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
1
Advanced Product Information
December 14, 2001
TGA4501-EPU
TABLE I MAXIMUM RATINGS Symbol V
+ -
Parameter 5/ Positive Supply Voltage Negative Supply Voltage Range Positive Supply Current (Quiescent) Gate Supply Current Input Continuous Wave Power Power Dissipation Operating Channel Temperature Mounting Temperature (30 Seconds) Storage Temperature
Value 8V -5V TO 0V 3.0 A 62 mA 24 dBm 18.4 W 150 C 320 C -65 to 150 0C
0 0
Notes 4/ 4/
V
I+ | IG | PIN PD TCH TM TSTG 1/ 2/
3/ 4/ 1/ 2/
These ratings apply to each individual FET. Junction operating temperature will directly affect the device median time to failure (TM). For maximum life, it is recommended that junction temperatures be maintained at the lowest possible levels. When operated at this bias condition with a base plate temperature of 70 0C, the median life is reduced from 7.4 E+6 to 4.6 E+5 hours. Combinations of supply voltage, supply current, input power, and output power shall not exceed PD. These ratings represent the maximum operable values for this device.
3/ 4/ 5/
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change without notice.
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
2
Advanced Product Information
December 14, 2001
TGA4501-EPU
TABLE II DC PROBE TEST (TA = 25 C 5 C) Symbol Idss (Q35)* Gm(Q35)* VP BVGS(Q35)* BVGD(Q35)* Parameter Saturated Drain Current Transconductance Pinch-off Voltage Breakdown Voltage GateSource Breakdown Voltage GateDrain Minimum 15 33 -1.5 -30 -30 Maximum 70.5 79.5 -0.5 -11 -11 Unit mA mS V V V
* Q35 is a 150 um Test FET
TABLE III AUTOPROBE FET PARAMETER MEASUREMENT CONDITIONS
FET Parameters
IDSS : Maximum drain current (IDS) with gate voltage (VGS) at zero volts.
Test Conditions
VGS = 0.0 V, drain voltage (VDS) is swept from 0.5 V up to a maximum of 3.5 V in search of the maximum value of IDS; voltage for IDSS is recorded as VDSP. For all material types, VDS is swept between 0.5 V and VDSP in search of the maximum value of Ids. This maximum IDS is recorded as IDS1. For Intermediate and Power material, IDS1 is measured at VGS = VG1 = -0.5 V. For Low Noise, HFET and pHEMT material, VGS = VG1 = -0.25 V. For LNBECOLC, use VGS = VG1 = -0.10 V. VDS fixed at 2.0 V, VGS is swept to bring IDS to 0.5 mA/mm.
Gm : Transconductance;
(I
DSS
- IDS 1
)
VG1
VP : Pinch-Off Voltage; VGS for IDS = 0.5 mA/mm of gate width. VBVGD : Breakdown Voltage, Gate-to-Drain; gate-to-drain breakdown current (IBD) = 1.0 mA/mm of gate width.
VBVGS : Breakdown Voltage, Gate-to-Source; gate-tosource breakdown current (IBS) = 1.0 mA/mm of gate width.
Drain fixed at ground, source not connected (floating), 1.0 mA/mm forced into gate, gate-to-drain voltage (VGD) measured is VBVGD and recorded as BVGD; this cannot be measured if there are other DC connections between gatedrain, gate-source or drain-source. Source fixed at ground, drain not connected (floating), 1.0 mA/mm forced into gate, gate-to-source voltage (VGS) measured is VBVGS and recorded as BVGS; this cannot be measured if there are other DC connections between gatedrain, gate-source or drain-source.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change without notice.
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
3
Advanced Product Information
December 14, 2001
TGA4501-EPU
TABLE IV RF WAFER CHARACTERIZATION TEST (TA = 25C + 5C) (Vd = 6V, Id = 2.048A 5%) Parameter Frequency Output P1dB Small Signal Gain Input Return Loss Output Return Loss Output TOI Unit GHz dBm dB dB dB dBm Min 28 33.5 16 Typical 34.5 18 -6 -6 40 Max 31
TABLE V THERMAL INFORMATION* Parameter RJC Thermal Resistance (channel to backside of carrier) Test Conditions Vd = 6V ID = 2.048 A Pdiss = 12.288 W TCH (oC) 127.65 RJC (C/W) 4.69 TM (HRS) 7.4E+6
Note: Assumes eutectic attach using 1.5 mil 80/20 AuSn mounted to a 20 mil CuMo Carrier at 70C baseplate temperature. Worst case condition with no RF applied, 100% of DC power is dissipated. * This information is a result of a thermal model analysis.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change without notice.
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
4
Advanced Product Information
December 14, 2001
TGA4501-EPU
Preliminary Measured Data
Bias Conditions: Vd = 6 V, Id = 2.1 A
19 18 17 16 Gain (dB) 15 14 13 12 11 10 28 28.5 29 29.5 Frequency (GHz) 30 30.5 31
35 34.5 34 Pout @ P1dB (dBm ) 33.5 33 32.5 32 31.5 31 28 28.5 29 29.5 Frequency (GHz) 30 30.5 31
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change without notice.
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
5
Advanced Product Information
December 14, 2001
TGA4501-EPU Chip Assembly & Bonding Diagram
Note: Please refer to page 8 for a magnified view of the chip assembly and bonding diagram
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change without notice.
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
6
Advanced Product Information
December 14, 2001
TGA4501-EPU Chip Assembly and Bonding Diagram
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change without notice.
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
7
Advanced Product Information
December 14, 2001
TGA4501-EPU Mechanical Drawing
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change without notice.
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
8
Advanced Product Information
December 14, 2001
TGA4501-EPU
Assembly Process Notes
Reflow process assembly notes: * * * * * Use AuSn (80/20) solder with limited exposure to temperatures at or above 300C. An alloy station or conveyor furnace with reducing atmosphere should be used. No fluxes should be utilized. Coefficient of thermal expansion matching is critical for long-term reliability. Devices must be stored in a dry nitrogen atmosphere.
Component placement and adhesive attachment assembly notes: * * * * * * * Vacuum pencils and/or vacuum collets are the preferred method of pick up. Air bridges must be avoided during placement. The force impact is critical during auto placement. Organic attachment can be used in low-power applications. Curing should be done in a convection oven; proper exhaust is a safety concern. Microwave or radiant curing should not be used because of differential heating. Coefficient of thermal expansion matching is critical.
Interconnect process assembly notes: * * * * * Thermosonic ball bonding is the preferred interconnect technique. Force, time, and ultrasonics are critical parameters. Aluminum wire should not be used. Discrete FET devices with small pad sizes should be bonded with 0.0007-inch wire. Maximum stage temperature is 200C.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change without notice.
TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994 8504 Web: www.triquint.com
9

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